Glossary

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There are currently 10 terms in this directory beginning with the letter P.
Packaging
In the case of transceiver development, it is the process of assembling the different parts of the transceiver (electronics, PIC, power supply) into the same package.

Partial Integration
In contrast to full integration / system-on-chip, an approach where only a few optical components are integrated on the same chip, while others are discrete and separate (such as the laser)

Passive Component
An optical component that does not require additional electrical energy to operate. Couplers, splitters, waveguides are an example of this.

Photon
The smallest unit of a beam of light. It does not have mass and travels at the speed of light.

Photonic Integrated Circuit
An optical circuit in which the components are integrated on a chip.
PIC

Photonics
The technological field that aims to integrate optical components on a single semiconductor chip, in a similar way to how electronics integrates electrical components on a chip.

Physical Layer
The lowest layer in the OSI model of networks. It is the layer closest to the physical connection between devices and that interfaces with the transmission medium
PHY

Pluggable
A smaller transceiver that can be easily "plugged" into another device such as a switch or router.

Power Usage Effectiveness
A ratio that describes how efficiently a data center uses energy. It is the ratio of total energy used by a data center facility to the energy delivered to computing equipment. An ideal PUE is 1.0 (energy deliver is perfectly efficient).
PUE

Pure Play Foundry
A semiconductor chip factory that manufactures devices for other companies without designing them. Two big examples are GlobalFoundries and TSMC in Taiwan.