DSP Archives - Page 3 of 3 - EFFECT Photonics

The Light Path to a Coherent Cloud Edge Banner

Insights

May 25, 2022

Improving Edge Computing with Coherent Optical Systems on Chip

Smaller data centers placed locally have the potential to minimize latency, overcome inconsistent connections, and…

Smaller data centers placed locally have the potential to minimize latency, overcome inconsistent connections, and store and compute data closer to the end-user. These benefits are causing the global market for edge data centers to explode, with PWC predicting that it will nearly triple from $4 billion in 2017 to $13.5 billion in 2024. Cloud-native applications are driving the construction of edge infrastructure and services. However, they cannot distribute their processing capabilities without considerable investments in real estate, infrastructure deployment, and management.

This situation leads to hyperscalers cooperating with telecom operators to install their servers in the existing carrier infrastructure. For example, Amazon Web Services (AWS) is implementing edge technology in carrier networks and company premises (e.g., AWS Wavelength, AWS Outposts). Google and Microsoft have strategies and products that are very similar. In this context, edge computing poses a few problems for telecom providers too. They must manage hundreds or thousands of new nodes that will be hard to control and maintain.

At EFFECT Photonics, we believe that coherent pluggables with an optical System-on-Chip (SoC) can become vital in addressing these datacom and telecom sector needs and enabling a new generation of distributed data center architectures. Combining the optical SoCs with reconfigurable DSPs and modern network orchestration and automation software will be a key to deploying edge data centers.

Edge data centers are a performance and sustainability imperative

Various trends are driving the rise of the edge cloud:

5G technology and the Internet of Things (IoT): These mobile networks and sensor networks need low-cost computing resources closer to the user to reduce latency and better manage the higher density of connections and data.
Content delivery networks (CDNs): The popularity of CDN services continues to grow, and most web traffic today is served through CDNs, especially for major sites like Facebook, Netflix, and Amazon. By using content delivery servers that are more geographically distributed and closer to the edge and the end user, websites can reduce latency, load times, and bandwidth costs as well as increasing content availability and redundancy.
Software-defined networks (SDN) and Network function virtualization (NFV). The increased use of SDNs and NFV requires more cloud software processing.
Augment and virtual reality applications (AR/VR): Edge data centers can reduce the streaming latency and improve the performance of AR/VR applications.

Several of these applications require lower latencies than before, and centralized cloud computing cannot deliver those data packets quickly enough. As shown in Table 1, a data center on a town or suburb aggregation point could halve the latency compared to a centralized hyperscale data center. Enterprises with their own data center on-premises can reduce latencies by 12 to 30 times compared to hyperscale data centers.

Type of Edge		Data center	Location	Number of DCs per 10M people	Average Latency	Size
On-premises edge		Enterprise site	Businesses	NA	2-5 ms	1 rack max
Network (Mobile)	Tower edge	Tower	Nationwide	3000	10 ms	2 rack max
	Outer edge	Aggrega- tion points	Town	150	30 ms	2-6 rack max
	Inner edge	Core	Major city	10	40 ms	10+ rack max
Regional edge		Regional	Major city	100	50 ms	100+ racks
Not edge		Hyperscale	State/ national	1	60+ ms	5000+ racks

Table 1: Types of edge data centers and their characteristics. Source: STL Partners

Cisco estimates that 85 zettabytes of useful raw data were created in 2021, but only 21 zettabytes were stored and processed in data centers. Edge data centers can help close this gap. For example, industries or cities can use edge data centers to aggregate all the data from their sensors. Instead of sending all this raw sensor data to the core cloud, the edge cloud can process it locally and turn it into a handful of performance indicators. The edge cloud can then relay these indicators to the core, which requires a much lower bandwidth than sending the raw data.

Figure 1 Global data center traffic vs. useable data created per year. Graphic sourced from Cisco Global Cloud Index.

Edge data centers therefore allow more sensor data to be aggregated and processed to make systems worldwide smarter and more efficient. The ultimate goal is to create entire “smart cities” that use this sensor data to benefit their inhabitants, businesses, and the environment. Everything from transport networks to water supply and lightning could be improved if we have more sensor data available in the cloud to optimize these processes. Distributing data centers is also vital for future data center architectures. While centralizing processing in hyper-scale data centers made them more energy-efficient, the power grid often limits the potential location of new hyperscale data centers. Thus, the industry may have to take a few steps back and decentralize data processing capacity to cope with the strain of data center clusters on power grids. For example, data centers can be relocated to areas where spare power capacity is available, preferably from nearby renewable energy sources. EFFECT Photonics envisions a system of datacentres with branches in different geographical areas, where data storage and processing are assigned based on local and temporal availability of renewable (wind-, solar-) energy and total energy demand in the area.

Figure 2: High-speed fiber-optic connections allow data processing and storage to move to locations where excess (green) energy is available. If power is needed for other purposes, such as charging electric vehicles, data can be moved elsewhere

Coherent technology simplifies the scaling of edge data center interconnects

As edge data center interconnects became more common, the issue of how to interconnect them became more prominent. Direct detect technology had been the standard in the short-reach data center interconnects. However, reaching the distances greater than 50km and bandwidths over 100Gbps required for modern edge data center interconnects required external amplifiers and dispersion compensators that increased the complexity of network operations. At the same time, advances in electronic and photonic integration allowed longer reach coherent technology to be miniaturized into QSFP-DD and OSFP form factors. This progress allowed the Optical Internetworking Forum (OIF) to create the 400ZR and ZR+ standards for 400G DWDM pluggable modules. With small enough modules to pack a router faceplate densely, the datacom sector could profit from a 400ZR solution for high-capacity data center interconnects of up to 80km. If needed, extended reach 400ZR+ pluggables can cover several hundreds of kilometers. Cignal AI forecasts that 400ZR shipments will dominate in the edge applications, as shown in Figure 3.

Figure 3: Forecast of 100G port equivalents shipped for edge applications. These shipments are overwhelmingly 400ZR standard technology. Source: Cignal AI Transport Applications Report Q42021.

Further improvements in integration can further boost the reach and efficiency of coherent transceivers. For example, by integrating all photonic functions on a single chip, including lasers and optical amplifiers, EFFECT Photonics’ optical System-On-Chip (SoC) technology can achieve higher transmit power levels and longer distances while keeping the smaller QSFP-DD form factor, power consumption, and cost.

Maximizing Edge Computing with Automation

With the rise of edge data centers, telecom providers must manage hundreds or thousands of new nodes that will be hard to control and maintain. Furthermore, providers also need a flexible network with pay-as-you-go scalability that can handle future capacity needs. Fortunately, several new technologies are enabling this scalable and automated network management.

First of all, the rise of self-tuning algorithms has made the installation of new pluggables easier than ever. They eliminate additional installation tasks such as manual tuning and record verification. They are host-agnostic, can plug into any third-party host equipment, and scale as you grow. Standardization also allows modules from different vendors to communicate with each other, avoiding compatibility issues and simplifying upgrade choices. The communication channels used for self-tuning algorithms can also be used for remote diagnostics and management, such as the case of EFFECT Photonics NarroWave technology.

Automation potential improves further by combining artificial intelligence with the software-defined networks (SDNs) framework that virtualizes and centralizes network functions. This creates an automated and centralized management layer that can allocate resources efficiently and dynamically. For example, AI in network management will become a significant factor in reducing the energy consumption of future telecom networks.

Figure 2: Comparing a traditional network approach (left) with an SDN/NFC approach (right).

Future smart transceivers with reconfigurable digital signal processors (DSPs) can give the AI-controlled management layer even more degrees of freedom to optimize the network. These smart transceivers will relay more device information for diagnosis, and depending on the management layer instructions, they can change their coding schemes to adapt to different network requirements

Takeaways

Cloud-native applications require edge data centers with lower latency, and that better fit the existing power grid. However, their implementation came with the challenges of more data center interconnects and a massive increase in nodes to manage. Fortunately, coherent pluggables with self-tuning can play a vital role in addressing these datacom and telecom sector challenges and enabling a new generation of distributed data center architectures. Combining these pluggables with modern network orchestration and automation software will boost the deployment of edge data centers. EFFECT Photonics believes that with these automation technologies (self-tuning, SDNs, AI), we can reach the goal of a self-managed, zero-touch automated network that can handle the massive scale-up required for 5G networks and edge computing.

Tags: 400ZR, artificial intelligence, cloud, coherent, computing, data centers, DSP, edge, edge data centers, infrastructure, latency, network, network edge, operators, optical system-on-chip, pluggables, self-tuning, services

Insights

April 28, 2022

Co-Designing Optics and Electronics for Versatile and Green Transceivers

Network and data center operators need fast and affordable pluggable transceivers that perform well enough…

Network and data center operators need fast and affordable pluggable transceivers that perform well enough to cover a wide range of link lengths. However, power consumption and thermal management are the big obstacles in the roadmap to scale high-speed transceivers into Terabit speeds.

Over the last two decades, power ratings for pluggable modules have increased as we moved from direct detection to more power-hungry coherent transmission: from 2W for SFP modules to 3.5 W for QSFP modules and now to 14W for QSSFP-DD and 21.1W for OSFP form factors. Rockley Photonics researchers estimate that a future electronic switch filled with 800G modules would draw around 1 kW of power just for the optical modules.

Around 50% of a coherent transceiver’s power consumption goes into the digital signal processing (DSP) chip that also performs the functions of clock data recovery (CDR), optical-electrical gear-boxing, and lane switching. Scaling to higher bandwidths leads to even more losses and energy consumption from the DSP chip and its radiofrequency (RF) interconnects with the optical engine.

Figure 1: Normalized power breakdown of the internal blocks of a 400ZR pluggable module. Although this breakdown may vary a bit among different vendors, the authors find it to be generally true for various DSP-based modules, both IM-DD and coherent. Source: R. Nagarajan et al., IEEE JLT (2021)

Thus, a great incentive exists to optimize the interface between the module’s DSP chip and the optical engine to make the transceiver more energy efficient. This need for optimization and efficiency makes co-designing the optical and electronic systems of the transceiver more important than ever.

Co-Designing the Optimal DSP

Coherent DSPs are already application-specific integrated circuits (ASICs), but they could fit their respective optical engines and use cases even more tightly. Transceiver developers often source their DSP, laser, and optical engine from different suppliers, so all these chips are designed separately from each other. This setup reduces the time to market and simplifies the research and design processes but comes with trade-offs in performance and power consumption.

In such cases, the DSP is like a Swiss army knife: a jack of all trades designed for different kinds of PIC but a master of none. For example, many 400ZR+ transceivers used for telecom metro and long-haul applications are using the same DSPs as 400ZR transceivers used for much shorter data center interconnects. Given the ever-increasing demand for capacity and the need for sustainability both as financial and social responsibility, transceiver developers are increasingly in need of a steak knife rather than a Swiss army knife.

Co-designing the DSP chip alongside the photonic integrated circuit (PIC) can lead to a much better fit between these components. A co-design approach helps identify in greater detail the trade-offs between various parameters in the DSP and PIC and thus improve system-level performance optimization. A DSP optimized for a specific optical engine and application could save up to a couple of Watts of power compared to the usual transceiver and DSP designs.

Figure 2: Simplified diagram of the building blocks of a coherent QSFP-DD transceiver. Original diagram source: Infinera

Co-designing DSP Interfaces for Power Efficiency

Since the optical engine and DSP operate with signals of differing intensities, they need some analog electronic components to “talk” to each other. On the transmit side, the electronic driver block takes signals from the DSP, converts them to a higher voltage, and drives the optical engine. On the receive side, a trans-impedance amplifier (TIA) block will boost the weak signal captured by the optical detector so that the DSP can more easily process it. This signal power conversion overhead constitutes roughly 10-15% of transceiver power consumption, as shown in Figure 1.

Co-designing the DSP and PIC could enable ways to decrease this power conversion overhead. For example, the modulator of the optical engine could be designed to run at a lower voltage that is more compatible with the signal output of the DSP. This way, the DSP could drive the optical engine directly without the need for the analog electronic driver. Such a setup could save roughly two watts of power consumption!

Figure-dac grey blocks — Figure 3: Simplified diagram of the building blocks of a coherent QSFP-DD transceiver in which the DSP drives the optical engine directly from its digital-to-analog converter (DAC). This setup can achieve a power consumption improvement of 10-15%.

Co-design is also vital to optimize the transceiver layout floorplan. This plan must consider the power dissipation of all transceiver building blocks to avoid hot spots and thermal interference from the DSP to the highly thermally sensitive PIC. The positioning of all bond pads and interfaces is also very important for signal and power integrity, requiring a co-design with the package and substrate.

During this floorplan development, the RF interconnections between the DSP and PIC can be made as short as possible. These optimized RF interconnects reduce the optical and thermal losses in the transceiver package and will reduce the power consumption of the analog electronic driver and amplifier.

Co-Designing Fit-For-Purpose DSPs and PICs

As shown in Figure 4, a DSP chip contains a sequence of processing blocks that compensate for different transmission issues in the fiber and then recover, decode, and error-correct the data streams. Different applications might require slightly different layouts of the DSP or might not need some processing blocks.

Figure 4: Simplified diagram of the processing blocks of a DSP chip.

For example, full DSP compensation might be required for long links that span several hundreds of kilometers, but a shorter link might not require all the DSP functions. In these cases, a transceiver could turn off or reduce certain DSP functions—such as chromatic dispersion compensation—to save power. These power-saving features could be particularly useful for the cases of shorter data center interconnect links (DCI). On the optical engine side, the laser might not require a high power to transmit over this shorter DCI link so the amplifier functions could shut down. Co-designing the DSP and PIC allows a transceiver developer to mix and match these different energy-saving features to achieve the lowest possible power for a specific application.

Takeaways

Power consumption has become the big barrier that prevents pluggable transceivers from scaling up to 800G and Terabit speeds. Overcoming this barrier requires a tighter fit between the optics and electronics of the transceiver, especially when it comes to the interface between the optical engine and the electronic DSP. By co-designing the optical engine and the electronic DSP, transceiver developers could avoid the need for an external electrical driver and reduce transceiver power consumption by 10-15%. A co-design approach can also make it easier to design fit-for-purpose transceivers that implement power-saving features tailored to specific application cases.

The benefits of this co-design approach led EFFECT Photonics to incorporate talent and intellectual property from Viasat’s Coherent DSP team. With this merger, EFFECT Photonics aims to co-design our Optical System-On-Chip with the DSP to develop fit-for-purpose transceivers that are more energy-efficient than ever before.

Download Article – PDF

Tags: acquisition, coherent, coherent communication systems, coherent optical module vendor, DSP, FEC, forward error correction, green, green transceivers, high vertical integration, independent coherent optical module vendor, Integrated Photonics, optical digital signal processing, optical engine, optical transceivers, photonic integration, Photonics, pluggables, Transceivers, tunable laser, tuneability

Reconfigurable DSPs for Versatile Pluggables

Insights

April 20, 2022

Reconfigurable DSPs for Versatile Pluggables

Carriers must solve the dilemma of how to use small and affordable coherent pluggables while…

Carriers must solve the dilemma of how to use small and affordable coherent pluggables while still having enough performance and reach to cover most of their network links. At EFFECT Photonics, we believe coherent pluggables with an optical System-on-Chip (SoC) can play a vital role in solving this carrier’s dilemma and simplifying network upgrades. Meanwhile, these new coherent pluggables could also enable longer, and higher-capacity data center interconnects for more sustainable data center architectures.

Another big factor in making networks more affordable and sustainable is software-defined networks (SDNs) and automation. SDNs enable the network function virtualization (NFV), which allows operators to implement more functions to manage and orchestrate the network. Operators will reap even further benefits by using an artificial intelligence (AI) management and orchestration layer with the SDN/NFV layer, as shown in the figure below.

Figure 1: Example of a carrier network with different applications (mobile, home, office) automated via NFV control and AI management.

However, creating a fully automated network that can handle the ever-increasing amount of data and connected devices requires us to go beyond just adjusting the higher network layers. The orchestration and management software should also interface with the physical layer of the network, and that requires smart optical pluggable that adapt to varying network requirements. These requirements place additional burdens on digital signal processors (DSPs). DSPs are a vital component of coherent communication systems, as they perform the coding, decoding, and error corrections on the optical signal. Fortunately, the advances in electronic integration and standards make it so that a versatile coherent pluggable can benefit from an equally versatile and reconfigurable DSP.

Future Automated Networks Must Also Work on the Physical Layer

Telecom and datacom providers who want to become market leaders must scale up while also learning to allocate their existing network resources most efficiently and dynamically. SDNs can help achieve this efficient, dynamic network management. In a nutshell, the SDN paradigm separates the switching hardware from the software, allowing operators to virtualize network functions in a single centralized controller unit. This centralized management and orchestration (MANO) layer can implement network functions that the switches do not, allowing network operators to allocate network resources more intelligently and dynamically. This added flexibility and optimization will improve network outcomes for operators.

However, the upcoming 5G networks will consist of a massive number of devices, software applications, and technologies. EFFECT Photonics believes that handling all these new devices and use cases will require self-managed, zero-touch automated networks. Realizing this full network automation requires two additional components alongside SDN and NFV:

Artificial intelligence and machine learning algorithms for complete network automation: For example, AI in network management will become a significant factor in reducing the energy consumption of future telecom networks.
Sensor and control data flow across all OSI model layers, including the physical layer: As networks get bigger and more complex, the management and orchestration (MANO) software needs more degrees of freedom and knobs to adjust. Next-generation MANO software needs to adjust and optimize both the physical and network layers to fit the network best.

Achieving the second goal requires smart optical equipment and components that can be diagnosed and managed remotely from the MANO layer. This context is where smart pluggable transceivers with reconfigurable DSPs come into play.

The Importance of Standardized Error Correction

Forward error correction (FEC) implemented by DSPs has become a vital component of coherent communication systems. FEC makes the coherent link much more tolerant to noise than a direct detect system and enables much longer reach and higher capacity. Thanks to FEC, coherent links can handle bit error rates that are literally a million times higher than a typical direct detect link. In other words, FEC algorithms allow the DSP to enhance the link performance without changing the hardware. This enhancement is analogous to imaging cameras: image processing algorithms allow the lenses inside your phone camera to produce a higher-quality image.

Figure 1 Simplified diagram of a network link with Forward Error Correction (FEC). — Figure 3: Simplified diagram of a network link with forward error correction (FEC). The FEC encoder adds a series of redundant bits (called overhead) to the transmitted data stream. The receiver can use this overhead to check for errors without asking the transmitter to resend the data.

When coherent transmission emerged, all FEC algorithms were proprietary. Equipment and component manufacturers closely guarded their FEC because it provided a critical competitive advantage. Therefore, coherent transceivers from different vendors could not operate with each other, and a single vendor had to be used for the entire network deployment. However, vendors had to adapt with data center providers pushing disaggregation deeper into communication networks. Their coherent transceivers needed to become interoperable, so FEC algorithms needed standardization. The OIF 400ZR standard for data center interconnects uses a public algorithm called concatenated FEC (CFEC). In contrast, some 400ZR+ MSA standards use open FEC (oFEC), which provides a more extended reach at the cost of a bit more bandwidth and energy consumption. For the longest possible link lengths (500+ kilometers), proprietary FECs become necessary for 400G transmission. Still, at least the public FEC standards have achieved interoperability for a large segment of the 400G transceiver market.

A Smart DSP to Rule All Network Links

A smart pluggable transceiver that can adapt to all the applications we have mentioned before—data centers, carrier networks, SDNs—requires an equally smart and versatile DSP. It must be a DSP that can be reconfigured via software to adapt to different network conditions and use cases. For example, a smart DSP could switch among different FEC algorithms to adapt to network performance and use cases. For example, let’s look at the case of upgrading a long metro link of 650km running at 100 Gbps with open FEC. The operator needs to increase that link capacity to 400 Gbps, but open FEC could struggle to provide the necessary link performance. However, if the DSP can be reconfigured to use a proprietary FEC standard, the transceiver will be able to handle this upgraded link.

	400ZR	Open ZR+	Proprietary Long Haul
Target Application	Edge data center interconnect	Metro, Regional data center interconnect	Long-Haul Carrier
Target Reach @ 400G	120km	500km	1000 km
Form Factor	QSFP-DD/OSFP	QSFP-DD/OSFP	QSFP-DD/OSFP
FEC	CFEC	oFEC	Proprietary
Standards / MSA	OIF	OpenZR+ MSA	Proprietary

Table 1: Summary of different use cases and standards for a 400G pluggable transceiver.

Reconfigurable DSPs can also be beneficial to auto-configure links to deal with specific network conditions, especially in brownfield links. For example, the DSP can be reconfigured to transmit at a higher baud rate if the link has a good quality fiber. However, the DSP could be reconfigured to scale down the baud rate to avoid bit errors if the fiber quality is poor. If the smart pluggable detects that the fiber length is relatively short, it could scale down the laser transmitter power or the DSP power consumption to save energy.

Takeaways

A versatile pluggable that can handle different use cases – data center links, long metro links, and dynamic management and orchestration layers – must have the ability to use different coding and error coding schemes and adapt to different network requirements. The DSP must be equally versatile and switch among several operating modes – 400ZR, 400ZR+, proprietary – and error correction methods – cFEC, oFEC, and proprietary. Together with a programmable optical system on chip, the DSP can not just add software corrections but also make optical hardware changes (output power, turn amplifiers on/off) to adapt to different noise scenarios. Through these adjustments, the next generation of pluggable transceivers will be able to handle all the telecom carrier and data center use cases we can throw at it.

Press Releases

March 8, 2022

EFFECT Photonics Acquires Coherent Optical Digital Signal Processing Business from Viasat

EFFECT Photonics to Become the Most Highly Vertically Integrated, Independent Coherent Optical Module Vendor San…

EFFECT Photonics to Become the Most Highly Vertically Integrated, Independent Coherent Optical Module Vendor

San Diego, United States America – Today at OFC (Optical Fiber Conference) 2022, EFFECT Photonics, a leading provider of highly integrated optical communication products is announcing that it signed a definitive agreement to acquire coherent optical digital signal processing (DSP) and forward error correction (FEC) technology as well as a highly experienced engineering team from global communications company, Viasat Inc. (NASDAQ: VSAT).

Viasat is a long-established player in DSP and FEC technology. With eight generations of design IP, they have a proven track record of delivering successful field deployments.

From this acquisition, EFFECT Photonics will now own the entire coherent technology stack of all optical functions, including a high-performance tunable laser, together with DSP and FEC. This will enable the Company to deliver on its ambition to make high performance coherent communications solutions widely accessible and affordable. Furthermore, it will enable longer term economic and environmentally sustainable communications due to the ability to deliver high-end performance and reach within a small footprint and with lower power consumption. This opens the way to drive coherent technology into new places, revolutionizing the way the world interconnects.

This transaction is expected to provide the following customer benefits:

EFFECT Photonics will be able to optimize the complete solution for any application addressing both existing challenges and new possibilities
With full ownership of the key optical, DSP and FEC functions, EFFECT Photonics can offer seamless integration, cost efficiency and security of supply
EFFECT Photonics will be an independent vendor able to offer a full portfolio of building blocks such as the tunable laser and DSP, and/or complete solutions, increasing the choice reduced by recent mergers and acquisitions in the industry

EFFECT Photonics has also secured an additional $20M in Series-C funding bringing the total to $63M. Additionally, pursuant to the DSP acquisition agreement, Viasat will be joining EFFECT Photonics’ Supervisory Board and hold a minority interest in the Company.

“This is a significant step in accelerating our ambition to make coherent optical communications ubiquitous and further drive our product portfolio growth. We look forward to welcoming the team of highly skilled and experienced design architects and engineers who will be joining us to drive the development of energy efficient, high performance and affordable coherent solutions.

With all the recent changes in the industry landscape, this means that EFFECT Photonics is the only independent vendor able to deliver both the active optical components and the DSP. This will offer the market more choice and the ability to source superior solutions“
James Regan, CEO EFFECT Photonics.

“Given the trend of the fiber optic communications industry towards consolidation to provide vertically integrated end-to-end solutions, we believe that combining Viasat’s assets and capabilities with the unique integrated photonics capabilities of EFFECT Photonics will create substantially more market opportunities and better products. By investing in this Netherlands-headquartered company, we will also further expand our presence in Europe and be able to partner with EFFECT to bring state-of-the-art integrated photonics to Viasat’s own customers.”
Russell Fuerst, business area leader and vice president, Viasat.

–End of press release–

About EFFECT Photonics

EFFECT Photonics delivers highly integrated optical communications products based on its Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology. The key enabling technology for DWDM systems is full monolithic integration of all photonic components within a single chip and being able to produce these in volume with high yield at low cost. With this capability, EFFECT Photonics is addressing the need for affordable DWDM solutions driven by the soaring demand for high bandwidth connections. EFFECT Photonics is headquartered in The Netherlands, with additional facilities in the UK, the US and Taiwan, and a worldwide network of sales partners. http://www.effectphotonics.com

About Viasat

Viasat is a global communications company that believes everyone and everything in the world can be connected. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the world communicate. Today, the Company is developing the ultimate global communications network to power high-quality, secure, affordable, fast connections to impact people’s lives anywhere they are—on the ground, in the air or at sea. To learn more about Viasat, visit: www.viasat.com, go to Viasat’s Corporate Blog, or follow the Company on social media at: Facebook, Instagram, LinkedIn, Twitter or YouTube.

Copyright © 2022 EFFECT Photonics. All rights reserved. Viasat, the Viasat logo and the Viasat signal are registered trademarks of Viasat, Inc. All other product or company names mentioned are used for identification purposes only and may be trademarks of their respective owners.

Tags: acquisition, coherent, coherent communication systems, coherent optical module vendor, DSP, FEC, forward error correction, high vertical integration, independent coherent optical module vendor, Integrated Photonics, optical digital signal processing, optical engine, tunable laser, Viasat

How To Make a Photonic Integrated Circuit

Press Releases

March 10, 2020

EFFECT Photonics Tapes out World’s First full Photonic Integration Coherent PIC

Building on its Full Photonic Integration InP wafer scale platforms, EFFECT Photonics has taped out…

Building on its Full Photonic Integration InP wafer scale platforms, EFFECT Photonics has taped out the Manta chip: the world’s first fully integrated coherent PIC targeted at pluggable coherent transceivers for the edge and metro/access networks.

The Manta PIC fully integrates an ultra-narrow linewidth full band tunable laser, 64Gbaud coherent receiver, 64Gbaud coherent transmitter, wavelength locking and on-chip amplification for the transmit and receive paths. This gives unprecedented OSNR performance with power consumption lower than a stand-alone ITLA.

Tim Koene, VP Engineering at EFFECT Photonics, describes the benefits of the approach: “Full Photonic Integration means including all of the needed functions for coherent. In some approaches, the most costly functionalities, notably the laser, amplification and wavelength locking, are not integrated, and this creates optical loss, higher cost and higher assembly complexity. Truly integrating everything allows us to overcome those hurdles and create a high-performance, low-power consumption, low-cost solution for coherent.”

EFFECT Photonics will build small form-factor coherent pluggables optimised for industrial temperature operation. They will be deployed in next generation access networks and be able to provide turnkey coherent transmission over 120km of unamplified links.

James Regan, CEO at EFFECT Photonics, comments on the achievement: “Being able to deliver this single-chip solution in the same industrial-temperature specification, non-hermetic platform, with which we are shipping our tunable SFP+ targeting 5G wireless connectivity, is a game changer. It enables us to execute on our strategy and take the benefits of coherent technology closer than has been possible before to the end user in high-volume applications.”

The Manta PIC is fabricated on EFFECT Photonics’ 3″ InP platform and will be ported to 4″ fabrication later this year. It is set to drive a revolution in cost optimisation for the next generation of coherent networks.

-End-

About EFFECT Photonics

EFFECT Photonics delivers highly integrated optical communications products based on its Dense Wavelength Division Multiplexing (DWDM) optical System-on-Chip technology. The key enabling technology for DWDM systems is full monolithic integration of all photonic components within a single chip and being able to produce these in volume with high yield at low cost. With this capability, EFFECT Photonics is addressing the need for low cost DWDM solutions driven by the soaring demand for high bandwidth connections between datacenters and back from mobile cell towers. Headquartered in Eindhoven, The Netherlands, with additional R&D and manufacturing in South West UK, with sales partners worldwide. www.effectphotonics.com

For further information please contact sales@effectphotonics.com

Tags: 5G, DSP, Integrated Photonics, Photonics, PIC

Core Industries

Emerging Industries

Our Technology

Coherent Pluggable Modules

Sub-Assemblies: pITLA

DSP

View All

Insights

Press Releases

In the News

Events

Careers

Knowledge Center

Company Info

Contact Us

Core Industries

Emerging Industries

Our Technology

Coherent Pluggable Modules

Sub-Assemblies: pITLA

DSP

View All

Insights

Press Releases

In the News

Events

Careers

Knowledge Center

Company Info

Contact Us