BNR – Zakendoen 23:45
EFFECT Photonics
Shining a Light on Four Tunable Lasers
The world is moving towards tunability. Datacom and telecom companies may increase their network capacity…
The world is moving towards tunability. Datacom and telecom companies may increase their network capacity without investing in new fiber infrastructure thanks to tunable lasers and dense wavelength division multiplexing (DWDM). Furthermore, the miniaturization of coherent technology into pluggable transceiver modules has enabled the widespread implementation of IP over DWDM solutions. Self-tuning algorithms have also contributed to the broad adoption of DWDM systems since they reduce the complexity of deployment and maintenance.
The tunable laser is a core component of all these tunable communication systems, both direct detection and coherent. The fundamental components of a laser are the following:
- An optical resonator (also called an optical cavity) that allows laser light to re-circulate and feed itself back. Resonators can be linear or ring-shaped. Linear resonators have a highly reflective mirror on one end and a partially-reflective mirror on the other, which acts as a coupler that lets the laser light out. On the other hand, ring resonators use a waveguide as an output coupler.
- An active medium (also called a gain medium) inside the resonator that, when pumped by an external energy source, will amplify the power of light by a process called stimulated emission.
- A pump source is the external energy source that powers the amplification process of the gain medium. The typical tunable laser used in communications will use an electrical pump, but some lasers can also use an optical pump (i.e., another light source).
As light circulates throughout the resonator, it passes multiple times through the pumped gain medium, amplifying itself and building up power to become the highly concentrated and coherent beam of light we know as a laser.
There are multiple ways to tune lasers, but let’s discuss three common tuning methods. These methods can and are often used together.
- Tuning the Gain Medium: By changing the pump intensity or environmental conditions such as its temperature, the gain medium can amplify different frequencies of light.
- Tuning the Resonator Length: The light inside a resonator goes back and forth at a frequency that depends on the length of the resonator. So making the resonator shorter or longer can change its frequency.
- Tuning by Filtering: Adding a filtering element inside or outside the resonator, such as a diffraction grating (i.e., a periodic mirror), allows the laser to “select” a specific frequency.
With this short intro on how lasers work and can be tuned, let’s dive into some of the different tunable lasers used in communication systems.
Distributed Feedback Lasers
Distributed Feedback (DFB) lasers are unique because they directly etch a grating onto the gain medium. This grating acts as a periodic mirror, forming the optical resonator needed to recirculate light and create a laser beam. These lasers are tunable by tuning the temperature of the gain medium and by filtering with the embedded grating.
Compared to their predecessors, DFB lasers could produce very pure, high-quality laser light with lower complexity in design and manufacturing that could be easily integrated into optical fiber systems. These characteristics benefited the telecommunications sector, which needed lasers with high purity and low noise that could be produced at scale. After all, the more pure (i.e., lower linewidth) a laser is, the more information it can encode. Thus, DFB lasers became the industry’s solution for many years.
The drawback of DFB lasers is that embedding the grating element in the gain medium makes them more sensitive and unstable. This sensitivity narrows their tuning range and makes them less reliable as they age.
Distributed Bragg Reflector (DBR) Lasers
A simple way to improve the reliability compared to a DFB laser is to etch the grating element outside the gain medium instead of inside. This grating element (which in this case is called a Bragg reflector) acts as a mirror that creates the optical resonator and amplifies the light inside. This setup is called a distributed Bragg reflector (DBR) laser.
While, in principle, a DBR laser does not have a wider tuning range than a DFB laser, its tuning behavior is more reliable over time. Since the grating is outside the gain medium, the DBR laser is less sensitive to environmental fluctuations and more reliable as it ages. However, as coherent and DWDM systems became increasingly important, the industry needed a greater tuning range that DFB and DBR lasers alone could not provide.
External Cavity Lasers (ECL)
Interestingly enough, one of the most straightforward ways to improve the quality and tunability of a semiconductor laser is to use it inside a second, somewhat larger resonator. This setup is called an external cavity laser (ECL) since this new resonator or cavity will use additional optical elements external to the original laser.
The main modification to the original semiconductor laser is that instead of having a partially reflective mirror as an output coupler, the coupler will use an anti-reflection coating to become transparent. This helps the original laser resonator capture more light from the external cavity.
The new external resonator provides more degrees of freedom for tuning the laser. If the resonator uses a mirror, then the laser can be tuned by moving the mirror a bit and changing the length of the resonator. If the resonator uses a grating, it has an additional element to tune the laser by filtering.
ECLs have become the state-of-the-art solution in the telecom industry: they use a DFB or DBR laser as the “base laser” and external gratings as their filtering element for additional tuning. These lasers can provide a high-quality laser beam with low noise, narrow linewidth, and a wide tuning range. However, they came with a cost: manufacturing complexity.
ECLs initially required free-space bulk optical elements, such as lenses and mirrors, for the external cavity. One of the hardest things to do in photonics is coupling between free-space optics and a chip. This alignment of the free-space external cavity with the original laser chip is extremely sensitive to environmental disturbances. Therefore, their coupling is often inefficient and complicates manufacturing and assembly processes, making them much harder to scale in volume.
Laser developers have tried to overcome this obstacle by manufacturing the external cavity on a separate chip coupled to the original laser chip. Coupling these two chips together is still a complex problem for manufacturing but more feasible and scalable than coupling from chip to free space optics. This is the direction many major tunable laser developers will take in their future products.
Integrated Tunable Ring Lasers
As we explained in the introductory section, linear resonators are those in which light bounces back and forth between two mirrors. However, ring resonators take a different approach to feedback: the light loops multiple times inside a ring that contains the active medium. The ring is coupled to the rest of the optical circuit via a waveguide.
The power of the ring resonator lies in its compactness, flexibility, and integrability. While a single ring resonator is not that impressive or tunable, using multiple rings and other optical elements allows them to achieve performance and tunability on par with the state-of-the-art tunable lasers that use linear resonators.
Most importantly, these widely tunable ring lasers can be entirely constructed on a single chip of Indium Phosphide (InP) material. As shown in this paper from the Eindhoven University of Technology, these lasers can even be built with the same basic building blocks and processes used to make other elements in the InP photonic integrated circuit (PIC).
This high integration of ring lasers has many positive effects. It can avoid inefficient couplings and make the laser more energy efficient. Furthermore, it enables the development of a monolithically integrated laser module where every element is included on the same chip. This includes integrating the wavelength locker component on the same chip, an element most state-of-the-art lasers attach separately.
As we have argued in previous articles, the more elements can be integrated into a single chip, the more scalable the manufacturing process can become.
Takeaways
Factors such as output power, noise, linewidth, tuning range, and manufacturability are vital when deciding which kind of laser to use. A DFB or DBR laser should do the job if wide tunability is not required. Greater tuning range will require an external cavity laser, but if the device must be manufactured at a large volume, an external cavity made on a chip instead of free-space optics will scale more easily. The latter is the tunable laser solution the telecom industry is gravitating towards.
That being said, ring lasers are a promising alternative because they can enable a widely tunable and monolithically integrated laser with all elements, including wavelength locker, on the same chip. This setup is ideal for scaling into high production volumes.
Tags: EFFECT Photonics, PhotonicsThe Promise of Integrated Quantum Photonics
Today’s digital society depends heavily on securely transmitting and storing data. One of the oldest…
Today’s digital society depends heavily on securely transmitting and storing data. One of the oldest and most widely used methods to encrypt data is called RSA (Rivest-Shamir-Adleman – the surnames of the algorithm’s designers). However, in 1994 mathematician Peter Shor proved that an ideal quantum computer could find the prime factors of large numbers exponentially more quickly than a conventional computer and thus break RSA encryption within hours or days.
While practical quantum computers are likely decades away from implementing Shor’s algorithm with enough performance and scale to break RSA or similar encryption methods, the potential implications are terrifying for our digital society and our data safety.
Given these risks, arguably the most secure way to protect data and communications is by fighting quantum with quantum: protect your data from quantum computer hacking by using security protocols that harness the power of quantum physics laws. That’s what quantum key distribution (QKD) does.
The quantum bits (qubits) used by QKD systems can be photons, electrons, atoms, or any other system that can exist in a quantum state. However, using photons as qubits will likely dominate the quantum communications and QKD application space. We have decades of experience manipulating the properties of photons, such as polarization and phase, to encode qubits. Thanks to optical fiber, we also know how to send photons over long distances with relatively little loss. Besides, optical fiber is already a fundamental component of modern telecommunication networks, so future quantum networks can run on that existing fiber infrastructure. All these signs point towards a new era of quantum photonics.
Photonic QKD devices have been, in some shape or form, commercially available for over 15 years. Still, factors such as the high cost, large size, and the inability to operate over longer distances have slowed their widespread adoption. Many R&D efforts regarding quantum photonics aim to address the size, weight, and power (SWaP) limitations. One way to overcome these limitations and reduce the cost per device would be to integrate every QKD function—generating, manipulating, and detecting photonic qubits—into a single chip.
Integration is Key to Bring Lab Technology into the Market
Bringing quantum products from lab prototypes to fully realized products that can be sold on the market is a complex process that involves several key steps.
One of the biggest challenges in bringing quantum products to market is scaling up the technology from lab prototypes to large-scale production. This requires the development of reliable manufacturing processes and supply chains that can produce high-quality quantum products at scale. Quantum products must be highly performant and reliable to meet the demands of commercial applications. This requires extensive testing and optimization to ensure that the product meets or exceeds the desired specifications.
In addition, quantum products must comply with relevant industry standards and regulations to ensure safety, interoperability, and compatibility with existing infrastructure. This requires close collaboration with regulatory bodies and industry organizations to develop appropriate standards and guidelines.
Photonic integration is a process that makes these goals more attainable for quantum technologies. By taking advantage of existing semiconductor manufacturing systems, quantum technologies can more scale up their production volumes more easily.
Smaller Footprints and Higher Efficiency
One of the most significant advantages of integrated photonics is its ability to miniaturize optical components and systems, making them much smaller, lighter, and more portable than traditional optical devices. This is achieved by leveraging micro- and nano-scale fabrication techniques to create optical components on a chip, which can then be integrated with other electronic and optical components to create a fully functional device.
The miniaturization of optical components and systems is essential for the development of practical quantum technologies, which require compact and portable devices that can be easily integrated into existing systems. For example, compact and portable quantum sensors can be used for medical imaging, geological exploration, and industrial process monitoring. Miniaturized quantum communication devices can be used to secure communication networks and enable secure communication between devices.
Integrated photonics also allows for the creation of complex optical circuits that can be easily integrated with other electronic components, to create fully integrated opto-electronic quantum systems. This is essential for the development of practical quantum computers, which require the integration of a large number of qubits (quantum bits) with control and readout electronics.
Economics of Scale
Wafer scale photonics manufacturing demands a higher upfront investment, but the resulting high-volume production line drives down the cost per device. This economy-of-scale principle is the same one behind electronics manufacturing, and the same must be applied to photonics. The more optical components we can integrate into a single chip, the more can the price of each component decrease. The more optical System-on-Chip (SoC) devices can go into a single wafer, the more can the price of each SoC decrease.
Researchers at the Technical University of Eindhoven and the JePPIX consortium have done some modelling to show how this economy of scale principle would apply to photonics. If production volumes can increase from a few thousands of chips per year to a few millions, the price per optical chip can decrease from thousands of Euros to mere tens of Euros. This must be the goal for the quantum photonics industry.
By integrating all optical components on a single chip, we also shift the complexity from the assembly process to the much more efficient and scalable semiconductor wafer process. Assembling and packaging a device by interconnecting multiple photonic chips increases assembly complexity and costs. On the other hand, combining and aligning optical components on a wafer at a high volume is much easier, which drives down the device’s cost.
Takeaways
Overall, bringing quantum products to market requires a multi-disciplinary approach that involves collaboration between scientists, engineers, designers, business professionals, and regulatory bodies to develop and commercialize a high-quality product that meets the needs of its target audience. Integrated photonics offers significant advantages in miniaturization and scale-up potential, which are essential in taking quantum technologies from the lab to the market.
Tags: Economy-of-scale, EFFECT Photonics, Integrated Photonics, miniaturization, Photonics, Photons, Quantum, Quantum products, Qubits, RSA encryption, Wafer Scale PhotonicsThe Future of Coherent Transceivers in the Access
The demand for data and other digital services is rising exponentially. From 2010 to 2020,…
The demand for data and other digital services is rising exponentially. From 2010 to 2020, Internet users worldwide doubled, and global internet traffic increased 12-fold. From 2020 to 2026, internet traffic will likely increase 5-fold. To meet this demand, datacom and telecom operators need constantly upgrade their transport networks.
The major obstacles in this upgrade path remain the power consumption, thermal management, and affordability of transceivers. Over the last two decades, power ratings for pluggable modules have increased as we moved from direct detection to more power-hungry coherent transmission: from 2W for SFP modules to 3.5 W for QSFP modules and now to 14W for QSSFP-DD and 21.1W for OSFP form factors. This power consumption increase seems incompatible with the power constraints of the network edge.
This article will review trends in data rate, power consumption, and footprint for transceivers in the network edge that aim to address these challenges.
Downscaling Data Rates for the Access
Given the success of 400ZR pluggable coherent solutions in the market, discussions in the telecom sector about a future beyond 400G pluggables have often focused on 800G solutions and 800ZR. However, there is also increasing excitement about “downscaling” to 100G coherent products for applications in the network edge.
In the coming years, 100G coherent uplinks will become increasingly widespread in deployments and applications throughout the network edge. Some mobile access networks use cases must upgrade their existing 10G DWDM link aggregation into a single coherent 100G DWDM uplink. Meanwhile, cable networks and business services are upgrading their customer links from 1Gbps to 10Gbps, and this migration will be the significant factor that will increase the demand for coherent 100G uplinks. For carriers who provide converged cable/mobile access, these upgrades to 100G uplinks will enable opportunities to overlay more business services and mobile traffic into their existing cable networks.
You can read more about these developments in our previous article, When Will the Network Edge Go Coherent?
Moving Towards Low Power
Data centers and 5G networks might be hot commodities, but the infrastructure that enables them runs even hotter. Electronic equipment generates plenty of heat; the more heat energy an electronic device dissipates, the more money and energy must be spent to cool it down. These power efficiency issues do not just affect the environment but also the bottom lines of communications companies.
As shown in the table below, the growth of data centers and wireless networks will continue to drive power consumption upwards.
These power constraints are even more pressing in the access network sector. Unlike data centers and the network core, access network equipment lives in uncontrolled environments with limited cooling capabilities. Therefore, every extra watt of pluggable power consumption will impact how vendors and operators design their cabinets and equipment.
These struggles are a major reason why QSFP28 form factor solutions are becoming increasingly attractive in the 100ZR domain. Their power consumption (up to 6 watts) is lower than that of QSFP-DD form factors (up to 14 Watts), which allows them to be stacked more densely in access network equipment rooms. Besides, QSFP28 modules are compatible with existing access network equipment, which often features QSFP28 slots.
Aside from the move to QSFP28 form factors for 100G coherent, EFFECT Photonics also believes in two other ways to reduce power consumption.
- Increased Integration: The interconnections among smaller, highly-integrated optical components consume less power than those among more discrete components. We will discuss this further in the next section.
- Co-Design: As we explained in a previous article about fit-for-platform DSPs, a transceiver optical engine designed on the indium phosphide platform could be designed to run at a voltage compatible with the DSP’s signal output. This way, the optimized DSP could drive the PIC directly without needing a separate analog driver, doing away with a significant power conversion overhead
Can We Still Move Towards Smaller Footprints?
Moving toward smaller pluggable footprints should not necessarily be a goal, but as we mentioned in the previous section, it is a means toward the goal of lower power consumption. Decreasing the size of optical components and their interconnections means that the light inside the chip will travel a smaller distance and accumulate fewer optical losses.
Let’s look at an example of lasers. In the last decade, technological progress in tunable laser packaging and integration has matched the need for smaller footprints. In 2011, tunable lasers followed the multi-source agreement (MSA) for integrable tunable laser assemblies (ITLAs). The ITLA package measured around 30.5 mm in width and 74 mm in length. By 2015, tunable lasers were sold in the more compact Micro-ITLA form factor, which cut the original ITLA package size in half. And in 2019, laser developers (see examples here and here) announced a new Nano-ITLA form factor that reduced the size by almost half again.
Reducing the footprint of tunable lasers in the future will need even greater integration of their parts. For example, every tunable laser needs a wavelength locker component that can stabilize the laser’s output regardless of environmental conditions such as temperature. Integrating the wavelength locker component on the laser chip instead of attaching it externally would help reduce the laser package’s footprint and power consumption.
Another potential future to reduce the size of tunable laser packages is related to the control electronics. The current ITLA standards include the complete control electronics on the laser package, including power conversion and temperature control. However, if the transceiver’s main board handles some of these electronic functions instead of the laser package, the size of the laser package can be reduced.
This approach means the reduced laser package would only have full functionality if connected to the main transceiver board. However, some transceiver developers will appreciate the laser package reduction and the extra freedom to provide their own laser control electronics.
Takeaways
The ever-increasing bandwidth demands in access networks force coherent pluggables to face the complex problem of maintaining a good enough performance while moving to lower cost and power consumption.
The move towards 100G coherent solutions in QSFP28 form factors will play a major role in meeting the power requirements of the access network sector. Further gains can be achieved with greater integration of optical components and co-designing the optics and electronic engines of the transceiver to reduce inefficiencies. Further gains in footprint for transceivers can also be obtained by eliminating redundant laser control functions in both the laser package and the main transceiver board.
Tags: 100G Coherent Products, 400ZR Pluggable Coherent Solutions, 5G Networks, 800G Solutions, 800ZR, Affordability, Coherent Transceivers, datacom, Direct Detection, EFFECT Photonics, Internet Traffic, network edge, OSFP Form Factors, Photonics, Pluggable Modules, power consumption, Power Efficiency, QSFP Modules, QSSFP-DD, Telecom Operators, Thermal ManagementKing Willem Alexander gets a taste of the future in Eindhoven via a deep dive into the world of integrated photonics
– InnovationOrigins
Emerging Photonics Ecosystem at the Heart of King’s Visit to Holst Centre and PhotonDelta
Eindhoven, The Netherlands During King Willem-Alexander’s visit to the High Tech Campus in Eindhoven on…
Eindhoven, The Netherlands
During King Willem-Alexander’s visit to the High Tech Campus in Eindhoven on April 20, he gained insight into the value chain of integrated photonics in the Netherlands and Europe from various perspectives. This emerging chip technology is accelerating thanks to a €1.1 billion program led by PhotonDelta. With demonstrations at Holst Centre and roundtable discussions at PhotonDelta, the King learned about the essence of the technology, its applications, and its importance for the future of the Netherlands and Europe.
Ewit Roos, CEO of PhotonDelta, is very pleased with the day’s outcome.
Ewit Roos, CEO at PhotonDeltaThe King’s visit is a tremendous honor for the ecosystem. It underlines once again the importance of integrated photonics for our country. We told him about the applications of integrated photonics for innovations in medical diagnostics, autonomous driving, the agricultural sector, and data communications. PhotonDelta and Holst Centre are central to the development of this new value chain. For the King, this was certainly a wonderful opportunity to get the most complete picture possible of the quality of the unique position of the ecosystem and all the opportunities that still lie ahead.
Photonics is all about the interaction between light (photons) and matter. Through photonics, data can be transmitted at the speed of light, reducing energy consumption and increasing efficiency. Integrated photonic chips, considered a key technology worldwide, enable the development of smaller, faster, and energy-efficient devices. This will lead to innovations that will help solve the major challenges of our time and contribute to a healthy and sustainable future.
National Growth Fund
The Netherlands has recognized the opportunities of integrated photonics through the National Growth Fund. PhotonDelta, the ecosystem of organizations in photonic chip technology, has mobilized public and private investment totaling 1.1 billion euros through this fund to transform the Netherlands into a leader in the next generation of semiconductors.
The investment consists of 470 million euros through the growth fund, with the rest coming from other partners and stakeholders. It is all part of the Dutch government’s plan to strengthen the country’s position as a world leader in integrated photonics.
Demonstrations and Roundtable Discussion
The King first visited Holst Centre, a collaboration between the research centers imec and TNO. Researchers from different disciplines develop new technology for photonic chips and prototypes that companies can use for their production process and new products.
The King was given a tour of Holst Centre’s laboratory and attended demonstrations of the application of photonics in various sectors. Representatives from Signify, EFFECT Photonics, Delta Diagnostics, Quix Quantum, and Lionix explained the different stages in the value chain. During this tour, the main focus was on the applications that help solve society’s critical challenges.
Integrated photonics is one of the pillars of Holst Centre’s strategy. By combining the expertise of imec and TNO, many aspects needed in the development and production process can be offered, such as design, prototyping, testing, and manufacturing. We combine the photonic microchip technology of imec in Belgium, the complementary photonic platforms in the Netherlands, the design expertise of imec in the Netherlands, and the optics and systems integration knowledge of TNO to help develop new sustainable solutions in different industries.
Kathleen Philips, director of imec at Holst Centre
The subsequent visit to PhotonDelta, also at the High Tech Campus, began with a presentation on the ecosystem. In recent years, PhotonDelta has grown this community from 12 to 60 stakeholders who together form a value chain that conceives, develops, and makes photonic chips and solutions based on them. The roundtable discussion covered topics such as industrialization, application technology, and European cooperation. Phix Photonics Assembly, Smart Photonics, and Trumpf Photonics Components addressed the challenges and possible solutions in scaling up the most crucial industrialization processes. Following this talk, Synopsys NL and NXP discussed the challenges around application strategies: creating a library of easy-to-use building blocks for new applications. Finally, the European playing field came into focus through PhotonDelta itself and the Ministry of Economic Affairs. This covered Europe’s ambitions around strategic autonomy and the impact of the European Chips Act. Photonic chips have been designated as a key technology by the European Commission. Security of supply for digital technology is the guiding principle in the Chips Act.
Strategic autonomy does not mean developing a copy of the global semiconductor value chain in Europe, but taking unique European positions in these chains where we can be ‘world-class’. This implies interdependence through quality and capacity rather than taking over one-to-one what is already happening elsewhere. Integrated photonics is one such position where Europe can excel.
Ton van Mol, Director TNO at Holst Centre
About PhotonDelta
PhotonDelta is an ecosystem of organizations that conceive, develop and make solutions based on photonic chips. PhotonDelta supports the system by stimulating collaboration between stakeholders, providing funding, and connecting them to the market.
About Holst Centre
Holst Centre, a collaboration of imec and TNO, brings together expertise in wireless sensor technologies and flexible electronics under one roof. The sharing of specific knowledge in an open structure enables the alignment of research and innovation with societal issues in health and vitality, energy and climate, and mobility and industry 5.0.
# # #
More information:
PhotonDelta
Jorn Smeets, Chief Marketing Officer
M: 06 – 1147 8812
E: jorn@photondelta.com
W: www.photondelta.com
Imec at Holst Centre
Carolien van der Leegte, Communicatiemanager imec NL
M: 06 – 1760 4841
E: carolien.vanderleegte@imec.nl
W: www.holstcentre.com
W: www.imec-int.com
TNO at Holst Centre
Sara Joosten, Project Manager Marketing & Communications
M: 06 – 2915 6716
E: sara.joosten@tno.nl
W: www.holstcentre.com
W: www.tno.nl
One Watt Matters
Data centers and 5G networks might be hot commodities, but the infrastructure that enables them…
Data centers and 5G networks might be hot commodities, but the infrastructure that enables them runs even hotter. Electronic equipment generates plenty of heat; the more heat energy an electronic device dissipates, the more money and energy must be spent to cool it down.
The Uptime Institute estimates that the average power usage effectiveness (PUE) ratio for data centers in 2022 is 1.55. This implies that for every 1 kWh used to power data center equipment, an extra 0.55 kWh—about 35% of total power consumption—is needed to power auxiliary equipment like lighting and, more importantly, cooling. While the advent of centralized hyperscale data centers will improve energy efficiency in the coming decade, that trend is offset by the construction of many smaller local data centers on the network edge to address the exponential growth of 5G services such as the Internet of Things (IoT).
These opposing trends are one of the reasons why the Uptime Institute has only observed a marginal improvement of 10% in the average data center PUE since 2014 (which was 1.7 back then). Such a slow improvement in average data center power efficiency cannot compensate for the fast growth of new edge data centers.
For all the bad reputation data centers receive for their energy consumption, though, wireless transmission generates even more heat than wired links. While 5G standards are more energy-efficient per bit than 4G, Huawei expects that the maximum power consumption of one of their 5G base stations will be 68% higher than their 4G stations. To make things worse, the use of higher frequency spectrum bands and new IoT use cases require the deployment of more base stations too.
Prof. Earl McCune from TU Delft estimates that nine out of ten watts of electrical power in 5G systems turn into heat. This Huawei study also predicts that the energy consumption of wireless access networks will increase even more quickly than data centers in the next ten years—more than quadrupling between 2020 and 2030.
These power efficiency issues do not just affect the environment but also the bottom lines of communications companies. In such a scenario, saving even one watt of power per pluggable transceiver could quickly multiply and scale up into a massive improvement on the sustainability and profitability of telecom and datacom providers.
How One Watt of Savings Scales Up
Let’s discuss an example to show how a seemingly small improvement of one Watt in pluggable transceiver power consumption can quickly scale up into major energy savings.
A 2020 paper from Microsoft Research estimates that for a metropolitan region of 10 data centers with 16 fiber pairs each and 100-GHz DWDM per fiber, the regional interconnect network needs to host 12,800 transceivers. This number of transceivers could increase by a third in the coming years since the 400ZR transceiver ecosystem supports a denser 75 GHz DWDM grid, so this number of transceivers would increase to 17,000. Therefore, saving a watt of power in each transceiver would lead to a total of 17 kW in savings.
The power savings don’t end there, however. The transceiver is powered by the server, which is then powered by its power supply and, ultimately, the national electricity grid. On average, 2.5 Watts must be supplied from the national grid for every watt of power the transceiver uses. When applying that 2.5 factor, the 17 kW in savings we discussed earlier are, in reality, 42.5 kW. In a year of power consumption, this rate adds up to a total of 372 MWh in power consumption savings. According to the US Environmental Protection Agency (EPA), these amounts of power savings in a single metro data center network are equivalent to 264 metric tons of carbon dioxide emissions. These emissions are equivalent to consuming 610 barrels of oil and could power up to 33 American homes for a year.
Saving Power through Integration and Co-Design
Before 2020, Apple made its computer processors with discrete components. In other words, electronic components were manufactured on separate chips, and then these chips were assembled into a single package. However, the interconnections between the chips produced losses and incompatibilities that made their devices less energy efficient. After 2020, starting with Apple’s M1 processor, they fully integrate all components on a single chip, avoiding losses and incompatibilities. As shown in the table below, this electronic system-on-chip (SoC) consumes a third of the power compared to the processors with discrete components used in their previous generations of computers.
𝗠𝗮𝗰 𝗠𝗶𝗻𝗶 𝗠𝗼𝗱𝗲𝗹 | 𝗣𝗼𝘄𝗲𝗿 𝗖𝗼𝗻𝘀𝘂𝗺𝗽𝘁𝗶𝗼𝗻 | |
𝗜𝗱𝗹𝗲 | 𝗠𝗮𝘅 | |
2023, M2 | 7 | 5 |
2020, M1 | 7 | 39 |
2018, Core i7 | 20 | 122 |
2014, Core i5 | 6 | 85 |
2010, Core 2 Duo | 10 | 85 |
2006, Core Solo or Duo | 23 | 110 |
2005, PowerPC G4 | 32 | 85 |
Table 1: Comparing the power consumption of a Mac Mini with an M1 and M2 SoC chips to previous generations of Mac Minis. [Source: Apple’s website] |
The photonics industry would benefit from a similar goal: implementing a photonic system-on-chip. Integrating all the optical components (lasers, detectors, modulators, etc.) on a single chip can minimize the losses and make devices such as optical transceivers more efficient. This approach doesn’t just optimize the efficiency of the devices themselves but also of the resource-hungry chip manufacturing process. For example, a system-on-chip approach enables earlier optical testing on the semiconductor wafer and dies. By testing the dies and wafers directly before packaging, manufacturers need only discard the bad dies rather than the whole package, which saves valuable energy and materials. You can read our previous article on the subject to know more about the energy efficiency benefits of system-on-chip integration.
Another way of improving power consumption in photonic devices is co-designing their optical and electronic systems. A co-design approach helps identify in greater detail the trade-offs between various parameters in the optics and electronics, optimizing their fit with each other and ultimately improving the overall power efficiency of the device. In the case of coherent optical transceivers, an electronic digital signal processor specifically optimized to drive an indium-phosphide optical engine directly could lead to power savings.
When Sustainability is Profitable
System-on-chip (SoC) approaches might reduce not only the footprint and energy consumption of photonic devices but also their cost. The economics of scale principles that rule the electronic semiconductor industry can also reduce the cost of photonic systems-on-chip. After all, SoCs minimize the footprint of photonic devices, allowing photonics developers to fit more of them within a single wafer, which decreases the price of each photonic system. As the graphic below shows, the more chips and wafers are produced, the lower the cost per chip becomes.
Integrating all optical components—including the laser—on a single chip shifts the complexity from the expensive assembly and packaging process to the more affordable and scalable semiconductor wafer process. For example, it’s much easier to combine optical components on a wafer at a high volume than to align components from different chips together in the assembly process. This shift to wafer processes also helps drive down the cost of the device.
Takeaways
With data and energy demands rising yearly, telecom and datacom providers are constantly finding ways to reduce their power and cost per transmitted bit. As we showed earlier in this article, even one watt of power saved in an optical transceiver can snowball into major savings that providers and the environment can profit from. These improvements in the power consumption of optical transceivers can be achieved by deepening the integration of optical components and co-designing them with electronics. Highly compact and integrated optical systems can also be manufactured at greater scale and efficiency, reducing their financial and environmental costs. These details help paint a bigger picture for providers: sustainability now goes hand-in-hand with profitability.
Tags: 5G, data centers, EFFECT Photonics, efficiency, energy consumption, Photonics, Sustainability, TransceiversEFFECT Photonics Adds Executives
– Lightwave
EFFECT Photonics Extends Leadership Team
– Seasoned industry executives appointed as Senior Vice President of Product Development, Vice President of…
– Seasoned industry executives appointed as Senior Vice President of Product Development, Vice President of Operations and Global Head of Human Resources
Eindhoven, The Netherlands
EFFECT Photonics, a leading developer of highly integrated optical solutions, today announced the extension of its executive leadership team as it positions itself for continued rapid growth and long-term success.
Roberto Marcoccia, CEO, EFFECT Photonics“EFFECT Photonics is at a pivotal stage of growth. To capitalize on our unique market opportunity and to achieve our goal of leveraging our integrated optical technologies to deliver solutions that disrupt the status quo, it was time to expand our leadership team to achieve this mission. We are thrilled and excited to have these new leaders on board and the experience they bring in order to help us chart the course for the opportunity ahead.”
Leading EFFECT Photonics product development from concept to production, Dr. Ted Schmidt will serve as the company’s Senior Vice President of Product Development. An accomplished technical leader and technology pathfinder, Ted has over 20 years of fiberoptic transceiver development experience, delivering advanced optical technologies for industry leaders such as Lumentum, Juniper Networks, OpNext, and Stratalight Communications. With a PhD in Physics, is an inventor on 45 US patents and has authored numerous books, papers and articles in the field of optical communications.
To oversee EFFECT Photonics’ new operational structure including management of its supply chain and to work with its microelectronics ecosystem industry partners, Tony Englese joins the company as Vice President of Operations. Tony is an expert manufacturing and operations professional with a wide range of experience at companies such as Juniper Networks, Aurrion and Xsigo Systems (acquired by Oracle).
As EFFECT Photonics Global Head of Resources, Veronique Gremmen-de Groot is responsible for supporting the company’s growth and evolution and for management of all people-related activities. Veronique has an extensive background in Human Resources and organizational development for various industries, having worked for global companies such as KPN, Office Depot, TenneT and Conclusion.
About EFFECT Photonics
Where Light Meets Digital – EFFECT Photonics is a highly vertically integrated, independent optical systems company addressing the need for high-performance, affordable optic solutions driven by the ever-increasing demand for bandwidth and faster data transfer capabilities. Using our company’s field-proven digital signal processing and forward error correction technology and ultra-pure light sources, we offer compact form factors with seamless integration, cost efficiency, low power, and security of supply. By leveraging established microelectronics ecosystems, we aim to make our products affordable and available in high volumes to address the challenges in 5G and beyond, access-ready coherent solutions, and cloud and cloud edge services. For more information, please visit: www.effectphotonics.com. Follow EFFECT Photonics on LinkedIn and Twitter.
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Media Contact:
Colleen Cronin
EFFECT Photonics
colleencronin@effectphotonics.com
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