Principal Engineer – Packaging, Signal and Power Integrity

Principal Engineer – Packaging, Signal and Power Integrity

Principal Engineer – Packaging, Signal and Power Integrity

Maynard, United States

Full time

Bachelor degree

General overview

About us

Where Light Meets Digital – EFFECT Photonics is a highly vertically integrated, independent photonic semiconductor company addressing the need for high-performance, affordable optic solutions driven by the ever-increasing demand for bandwidth and faster data transfer capabilities. Our teams are made up of professional, highly skilled, energized, and enthusiastic people who share a passion for developing and creating high-volume, world-class solutions. We operate globally, and our teams work collaboratively to make EFFECT Photonics a very dynamic and rewarding place to work.

About the position

EFFECT Photonics is looking for an experienced – Principal Engineer (Packaging, Signal and Power integrity) 

We are seeking an experienced Packaging, Signal and Power Integrity Principal Engineer to join our growing team. This position involves diverse responsibilities, including evaluation of new packaging technology, package recommendation for our photonics solutions, substrate design support, and package qualification. You will work across our technical teams and help EFFECT Photonics to deliver its family of photonics solutions to the market.

Role responsibilities:

  • You will be interfacing with product architects, PIC designers, and DSP ASIC designers to distil and compile product needs and translate them into packaging requirements while identifying and aligning the appropriate packaging solution to meet the performance, cost and schedule expectations of the product Support the design optimization and material selection for good thermal management and reliability
  • Lead & oversee all package electrical characterizations and work closely with layout engineers to define package attributes, including the form-factor, stack-up, pin count, pinout, and optimum routing schemes with considerations to manufacturing constraints and performance targets
  • You will lead and oversee the thermal-mechanical solution development for the package stack including the socket and the loading mechanism for the product
  • Partner and align with supply chain operations to identify & align packaging technology and materials requirements for substrate fabrication, assembly and raw material vendors while interfacing with Q&R
  • Coordinate early-stage activities to ensure that formal qualification is low risk

Apply now!

Get In Touch!


About you

We want you to bring your expertise, experience, and passion for optical communications packaging design and development to the forefront of our organisation, thus helping us to create a world class company with a world class reputation.

Required / Desired knowledge, skills, and abilities

  • You will have a minimum of BS degree in electrical engineering, mechanical engineering, physics, material science, or a related field
  • 15+ years of experience in characterization and design of 2D & 2.5D flip-chip & wafer-scale packaging solutions
  • 10+ years of experience in the areas of power-signal integrity, thermal-mechanical
  • Understanding of packaging approaches and processes that are applied to coherent components for optical communications systems and the microelectronics industry highly desirable
  • Excellent skills in optical simulation, design and modelling using various tools and systems
  • Experience of design and fabrication at key industry CM including DFM
  • Strong understanding of simulation and statical analysis using DOE, profiling Monte Carlo etc
  • Working knowledge of various high-speed interfaces such as SERDES and Highspeed data convertors and well versed with various EDA & CAD tools
  • Proven track record of bringing up successful package/ product with high bandwidth applications from inception to product introduction
  • Candidate will be required to spend time in Maynard, Massachusetts location. Partial remote allowed

We are a collaborative Global Technology Company, and we’re building a truly dynamic and rewarding place to work.

Reward and Benefits

Benefits are a critical component to consider when taking on a new challenge, but because we are a global company, benefits may vary by location.

Here’s what you can expect from us regardless:

  • A fast-paced working culture where everyone’s point of view has real value
  • Genuine opportunities for self-development and career growth
  • An environment that embraces collaboration
  • A competitive salary that reflects our ambition
  • A flexible benefits scheme with health and pension plan (401 K – US Based roles)
  • Paid time off (vacation days) plus statutory annual holidays
  • Flexible working hours
  • Stock Appreciation Rights (SAR – stock program)

We look forward to receiving your application, if you have any questions, please get in touch with our recruitment team.

Email: - No agencies please!

Effect Photonics is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, sexual orientation, gender identity, national origin, disability status, protected veteran status, or any other characteristic protected by law. Effect Photonics complies with all applicable state and local laws governing non-discrimination in employment.


Share this post

Leave a Reply

Your email address will not be published.


Test 1

The world is moving towards tunability. The combination of tunable lasers and dense wavelength division…

Test 2

The world is moving towards tunability. The combination of tunable lasers and dense wavelength division…

Test 3

The world is moving towards tunability. The combination of tunable lasers and dense wavelength division…

Share This

Copy Link to Clipboard